Hong Kong Science and Technology Parks Corporation (HKSTP), and Fujitsu Microelectronics Limited's (FML) subsidiary e-Shuttle Inc. (ESI) in Japan have signed an agreement to provide silicon shuttle services for start-up integrated circuit (IC) design houses in Asia. The initiative, boosting Asia's semiconductor industry, provides first-of-a-kind Electron Beam Direct Writing (EBDW) technology at low cost. The proprietary EBDW technology developed by e-Shuttle significantly lowers the cost of prototyping ICs and reduces turnaround time.

Under the new initiative, HKSTP will provide development support, including design tools and evaluation systems and secured remote access design environment to design houses, which then send timing, power and other data to ESI for prototyping using the EBDW technology. The IC designers evaluate the design or product prototypes from e-Shuttle for recommendation to manufacturers. This process will allow even small and medium-sized design organizations to leverage leading prototyping technologies such as 65nm at very low cost. The program with e-Shuttle complements HKSTP's IC Design Centre, which incorporates a wide range of IP services, including test development, IP trial, licensing, integration and verification - plus a legal framework for semiconductor intellectual property development under an ISO 27001 certified design environment.

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