Magma® Design Automation Inc., a provider of semiconductor design software announced the availability of enhanced flip chip design support through the integration of the Talus^TM Vortex and Blast Fusion® physical design systems with Rio Design Automation's RioMagic, the electronics industry's first package-aware chip design software. With the enhanced capabilities, Magma provides tight links between IC implementation and package design and comprehensive redistribution layer (RDL) routing and bump placement capabilities, allowing designers to make packaging and performance tradeoffs and decisions earlier in the design process to ensure better quality of results (QoR), faster turnaround time and optimal packaging. 

RDL routing is necessary for designs that use flip chip interconnect packages - which utilize solder bumps on the chip pads instead of wire bonds - as well as for systems in package (SiPs). The RDL is an extra interconnect layer of wiring used to convert designs from perimeter to area array interconnect structures. Generally these redistribution layers not only route signals but also provide distributed power and ground. The Rio flow automatically routes the RDL on the die, which connects I/Os to bumps, and does the escape routing, which determines how routes "escape" into the package and connect bumps to balls. Rules-driven I/O sequencing and prototyping capabilities are also provided. The RDL routing and bump assignment information is easily imported into the Magma environment through a Tcl interface and used to complete the implementation. 

RioMagic and RIO RDL router are resold and supported by Magma through an original equipment manufacturer (OEM) agreement. This flow is available now through Magma.

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